MediaTek Says Its Dimensity 9000 SoC Is Ready For Next Generation Flagship Phones

In short: MediaTek wants to return to a high-end mobile SoC game, and its latest Dimensity chipset contains many enhancements designed to make it more competitive against the best offerings from Qualcomm and Samsung. The first devices with the new chip will arrive in the first half of 2022, so we will soon see if they are the flagship material.

For the past two years, MediaTek has been trying to break into the high-end smartphone market with mobile chipsets, which it says will compete with the Qualcomm Snapdragon 8xx series and Samsung’s flagship Exynos offerings. Dimensity 1000, 1100 and 1200 chipsets provide excellent performance and useful features such as 5G connectivity, AV1 hardware decoding, and support for high refresh rate displays. However, manufacturers have only adopted them for their mid-range phones like the OnePlus Nord 2 5G and OnePlus 11T.

Taiwanese company moves forward with announcement its Dimensity 9000 chipset, which could potentially seriously compete with the Qualcomm Snapdragon 898 and Samsung Exynos 2200 chipsets, which are expected to hit the market next year.

MediaTek says the new SoC will be built on TSMC’s 4nm process, and that in itself should provide some much-needed performance and efficiency improvements over previous Dimensity chipsets. The company also opted for a CPU configuration similar to the one used by its competitors in their future SoCs. This means that the new Dimensity chip will combine three clusters with one “super” Arm Cortex-X2 core, three high-performance Cortex-A710 cores and four energy efficient Cortex-A510 cores.

The Cortex-X2 processor core is allegedly 35 percent faster and 37 percent more power efficient than the Cortex-X1 core, and MediaTek also advertises eight megabytes of L3 cache and six megabytes of system level cache (SLC). For reference, the Qualcomm Snapdragon 888 SoC has four megabytes of L3 cache and three megabytes of SLC. Manufacturers will be able to combine Dimensity 9000 with LPDDR5X memory operating at speeds up to 7500 Mbps, which is also a welcome surprise from MediaTek.

The Dimensity 9000 also integrates a 10-core Mali-G710 GPU, which is the latest and greatest Arm implementation with 35% better performance and 60% more energy efficiency over the Snapdragon 888. It’s worth noting that this is a comparison of 4nm and 5nm parts. nm, so the real test will be with 4nm chipsets from Samsung and Qualcomm, which have yet to be announced.

Finbarr Moynihan, Vice President of MediaTek and General Marketing Leadership, explained the new GPU will also support software ray tracing as well as ray tracing via Vulkan for Android. Machine learning tasks will also run much faster on the new chipset, while being five times more energy efficient than the Dimensity 1200.

Another area of ​​improvement is multimedia support with the new Imagiq 790 DSP, which is twice the processing power of its predecessor. It supports up to one 320MP sensor or up to a triple 32MP camera. In addition to the video recording capabilities provided by the Dimensity 1200, the Dimensity 9000 supports 8K video recording at 24fps or up to three simultaneous 4K HDR streams.

In terms of connectivity, the Dimensity 9000 only supports 5G sub-6GHz, but MediaTek claims that is sufficient to achieve download speeds of up to 7Gbps using 3CC carrier aggregation. The new modem implementation should also provide increased battery life, which is currently more useful than mmWave support for anyone outside the US. Other notable features are Bluetooth 5.3 support, Wi-Fi 6E and full GNSS navigation.

As for when we can expect the first devices with the new chip to arrive, MediaTek says some of its partners are aiming for a launch window at the end of Q1 – early Q2 2022. The company is slowly eating up Qualcomm’s share of the mobile chipset market, and it will be interesting to see if it can continue to do so with higher-end offerings.

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