Intel’s 14th generation mobile processors will reportedly feature new low-power E-cores separated from the compute tile.

bottom line: Intel’s 14th generation processors will introduce several technologies the company is working on, including stacked design, new CPU and iGPU architectures, and the Intel Process Node 4. Today’s leak also mentions a new type of ultra-low power CPU core design.

Today we get an early look at upcoming 14th Gen Intel mobile platforms including Meteor Lake-U, -P and -H thanks to a new leak Igor’s laboratory. This generation of chips will be the first to use Intel’s tiled architecture. The mobile processors mentioned today consist of four tiles.

The compute tile will use the Intel manufacturing process 4 and have up to six P-cores and eight E-cores on ML-P and -H, while low-power ML-U processors will have two fewer P-cores at high end. -the end. These cores will reportedly have a new microarchitecture, so expect IPC performance improvements.

The GPU tile will use TSMC’s 3nm node and have up to 128 execution units, the same number as Intel’s Arc A380 discrete graphics card. It may also feature the new Xe-LPG GPU architecture, while current Alder Lake CPUs use Xe-LP.

Starting with Meteor Lake, Intel will split the PCH into two separate tiles. The SoC cell will presumably contain all the various controllers needed for a modern CPU, while the I/O tile will only have actual interfaces including USB, PCIe, and SATA.

The memory controller in these new processors will support up to 96GB of DDR5-5600 RAM and up to 64GB of LPDDR5X-7467 RAM, while Meteor Lake-H will also get support for PCIe 5.0 connectivity. This feature is currently only available on Alder Lake-S and -HX processors, both of which feature desktop-grade dies.

Interestingly, a SoC tile with two separate LP E-cores is also mentioned. These ultra low power cores can be used for background applications or when the device is in low power states such as hibernation or hibernation.

The leak claims that Intel Meteor Lake processors will arrive in the second half of next year.

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