Corsair: DDR5 memory needs better cooling as VRM moves into module

In the context: DDR5 modules will be faster and contain more memory than DDR4. This is in part due to the transfer of power management ICs and voltage regulation modules from the motherboard to the module itself, resulting in more heat sources that generate more heat.

Many believe that DDR4 and older modules do not generate enough heat to warrant using heatsinks, but due to some of the inherent changes in DDR5 memory, it looks like decent cooling solutions will be needed… One such difference is the relocation of power management integrated circuits (PMICs) and voltage regulation modules (VRMs) to the module, which generate more heat than their predecessors.

“Probably DDR5 can perform much better than DDR4. They moved the voltage regulation from the motherboard itself, and now it’s on [module]”said George Macris, director of DIY marketing for Corsair.

In the case of Corsair, they will use their DHX technology, which uses fins to remove heat from the outside of the chips and another set of fins to cool the inside. This technology was first used in his Dominator DDR1 modules and has been used in all other modules in the Dominator series ever since.

Read also: Anatomy of random access memory

Now that the DDR5 modules will include PMICs and VRMs on the PCB, they will need to be cooled. Corsair will likely take care of them by updating their DHX solution, but other manufacturers will also have to adapt their solutions to meet new cooling needs.

DDR5 memory is no longer on the market, but there are no platforms to support it. This is expected to change later this year with the release of Intel Alder Lake processors, also known as 12th Gen Core processors.

Meanwhile, memory manufacturers have demonstrated some of the characteristics of this new type of memory, capable of reaching speeds of 12,600 MT / s and up to 128 GB per module when operating at voltages up to 1.6 V.

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