Xiaomi on Friday November 5th announced a new technology called Loop LiquidCool, which is said to provide efficient cooling for smartphones’ processors. The heat dissipation method introduced by the Chinese smartphone giant is said to separate the circulation of hot air and coolant, which reduces heat generation problems in mobile phones. Inspired by cooling systems used in aerospace technology, Loop LiquidCool technology is a new take on the traditional steam chamber. It works by capillary action, which attracts liquid refrigerants to a heat source, vaporizes and then dissipates the heat to a cooler area. The company plans to implement Loop LiquidCool technology in its smartphones in the second half of 2022.
Xiaomi demonstrated blog about the new Loop LiquidCool technology. The company claims the new technology offers twice the cooling capabilities of traditional vapor chamber (VC) solutions. Loop LiquidCool technology includes an annular heat pipe system that includes an evaporator, condenser, filling chamber, gas and liquid pipes. When a significant load is loaded onto the smartphone, the refrigerant of the evaporator evaporates into gas. The gas and air stream then diffuse into the condenser, where the gas is further condensed into a liquid. These fluids are absorbed and collected through small fibers in the filling chamber, making it a self-sustaining system.
According to Xiaomi, the new technology uses the same method as the VC liquid cooling system. Even so, conventional VC systems do not have separate channels for gases and liquids. In Loop LiquidCool technology, the pump has a special gas tube design that is said to reduce resistance to air passage by 30 percent and increase heat transfer capacity by up to 100 percent.
With Tesla valve microstructure, one-way circulation is said to prevent heat from moving backwards and increase the heat dissipation capacity of standard steam chambers.
Xiaomi also illustrated new method on custom Xiaomi MIX 4 by replacing the original steam chamber with the new Loop LiquidCool Technology solution. The company said that in 30 minutes of running the Genshin Impact at 60 frames per second (fps) and maximum graphics settings, the heating did not exceed 47.7 degrees Celsius, and the processor was 8.6 degrees Celsius lower than in the standard version.
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