The MediaTek Dimensity 9000 SoC has been unveiled as the latest flagship processor to counter the high end of the Qualcomm Snapdragon chipset. This is the first mobile chipset built with TSMC’s 4nm process technology and utilizing the new Arm 9 architecture. The MediaTek Dimensity 9000 SoC integrates an Arm Mali-G710 10-core GPU and a total of six fifth-generation APU cores for AI processing. The new flagship SoC also includes the new 18-bit ISP Imagiq Gen 7, which claims to be the world’s first device to capture 320-megapixel images. It also offers Wi-Fi 6E and Bluetooth v5.3 support.
Company is talking that the first smartphones based on MediaTek DIme density 9000 SoC will appear sometime at the end of the first quarter of 2022. The chipset uses new processors with the Armv9 architecture, which include one Arm Cortex-X2 at 3.05 GHz, three Arm Cortex-A710 at up to 2.85 GHz, and four Arm Cortex-A510 processors. The chipset also supports LPDDR5x 7500 Mbps.
As mentioned, the MediaTek Dimensity 9000 SoC has a flagship 18-bit HDR-ISP design that allows you to capture HDR video on up to three cameras at the same time. It also supports 320MP smartphone cameras. The new fifth-generation six-core AI processor is said to deliver up to 4x more energy efficiency than the previous generation.
The MediaTek Dimensity 9000 SoC includes the latest ARM Mali-G710 GPU. The chipset claims to provide the industry’s first SDK for ray tracing using Vulkan for Android. It will also support a Full-HD + display with a 180Hz refresh rate. Dimensity 9000 integrates into the chip the only 5G modem for smartphones with standard 3GPP Release-16 technology. It features a built-in 5G modem that delivers up to 7Gbps downlink speeds, 3CC (300MHz) carrier aggregation and up to 300 percent higher uplink performance.
Connectivity options with the MediaTek Dimensity 9000 SoC include Bluetooth 5.3, Wi-Fi 6E 2 × 2, wireless stereo sound, and Beidou III-B1 C GNSS support.
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