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Honor Magic V foldable phone expected to launch on January 10 will feature sophisticated hinge technology

The Honor Magic V foldable smartphone could be released on January 10, according to a whistleblower. The Chinese company has already confirmed that it will soon unveil its first foldable phone. The report says the flagship will be powered by Qualcomm’s Snapdragon 8 Gen 1 SoC, making it the first foldable phone to sport the latest Snapdragon chipset. Honor’s former parent company Huawei recently launched the P50 Pocket foldable phone with Qualcomm Snapdragon 888 4G SoC in China.

According to tweet from expert Teme (@ RODENT950), the Honor Magic V will debut on January 10 in China. The Digital Chat Station tipster previously claimed that Honor’s foldable smartphone would be powered by Qualcomm’s Snapdragon 8 Gen 1 SoC, and reported that its starting price could be 10,000 yuan (roughly 1.18 lakh). There is no more detailed information on the characteristics of the smartphone.

However, in a short video general by Honor China on Weibo, Honor CEO Zhao Ming spoke about Honor Magic V. is talking (translated) that the foldable phone screen will be the best foldable screen on the market with its “most complete structure”. The CEO claims the Honor Magic V has sophisticated hinge technology and the optimization will be done in software.

Kidnaping competitors, Min said that some manufacturers have made foldable screens smaller, which significantly violates the original design of foldable phones. The Honor Magic V is expected to receive a dual-screen design. The internal display can be 8 “and the external secondary screen is 6.5”.

Recently, other Chinese smartphone makers Huawei and Oppo have released their foldable phones. Huawei unveiled the Huawei P50 Pocket smartphone and Oppo unveiled the Oppo Find N in the Chinese market.





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